HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 so it need be sold

so it need be sold as a set

Support manual / automatic white balance / one key white balance

with two modes of plate separation and mobile phone separation

solves the problem of repairing and fixing laptop motherboards

Small size 36

HMT-X1 Motherboard Layering Chip Glue Removal Heating Table Option:HMT-X1 so it need be soldHMT X1 ZJ X1 multi functional motherboard layered chip glue removal heating table for iPhone 16 15 14 13 12 11 X PCB layering tinning repair and chip glue removal. HMT X1 360W universal motherboard delamination and degumming heating table for mobile phone motherboard repair. Features: 1. Temperature control imported from Germany, rapid heating. 2. Turn on the chip degumming station temperature switch, the chip degumming station starts to heat up. 3.